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Litteluse FDA117 Photoisolated Photovoltaic Driver
Litteluse FDA117 Photoisolated Photovoltaic Driver 2024-01-30

  Litteluse has launched the FDA117 photovoltaic isolation driver, which can gen

EPSON Epson S1C17M02 and S1C17M03 high-precision A/D converters
EPSON Epson S1C17M02 and S1C17M03 high-precision A/D converters 2024-01-30

  Epson S1C17M02 and S1C17M03 are new energy-saving 16 bit microcontrollers equi

Infineon 160V HB and HS+LS SOI gate drivers
Infineon 160V HB and HS+LS SOI gate drivers 2024-01-30

MOTIX ™ The integrated circuit of 160V HB and HS+LS SOI (silicon on insulator)

ROHM Rom zero drift operational amplifier LMR1002F-LB
ROHM Rom zero drift operational amplifier LMR1002F-LB 2024-01-30

  The ROHM Rom zero drift operational amplifier "LMR1002F-LB" has been

Litteluse launches breakthrough over temperature detection platform TTape ™
Litteluse launches breakthrough over temperature detection platform TTape ™ 2024-01-30

  Litteluse launches breakthrough over temperature detection platform TTape ™, U

Nordic Semiconductor nPM1300 PMIC enters mass production stage
Nordic Semiconductor nPM1300 PMIC enters mass production stage 2024-01-29

Semiconductor announced that customers can now purchase the latest released nPM1

Efficiency enhancement and voltage stabilization, an indispensable PFC chip in energy storage equipment
Efficiency enhancement and voltage stabilization, an indispensable PFC chip in energy storage equipment 2024-01-29

For energy storage devices, charging and discharging are their basic functions,

SK Hynix develops reusable semiconductor CMP polishing pad technology
SK Hynix develops reusable semiconductor CMP polishing pad technology 2024-01-29

SK Hynix has recently developed a reusable CMP polishing pad technology, which n

TSMC's first 1nm A10 process is proposed, with plans to achieve single chip packaging of 1 trillion transistors by 2030
TSMC's first 1nm A10 process is proposed, with plans to achieve single chip packaging of 1 trillion transistors by 2030 2024-01-29

At the IEDM conference, TSMC formulated a chip packaging route that includes 1 t

Made of mass-produced micro quantum storage components, paving the way for large-scale industrialization
Made of mass-produced micro quantum storage components, paving the way for large-scale industrialization 2024-01-29

The glass chamber, which is only a few millimeters in size, is filled with rubid

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